Package including a plurality of stacked semiconductor devices, an interposer and interface connections

ABSTRACT

A package can include a number of stacked dynamic random access memory (DRAM) semiconductor devices and an interposer. Wirings can be formed in the interposer to provide electric connections essentially orthogonal between the first and second surfaces of the interposer to external connections. Through vias can provide electrical connections between surfaces of the DRAM semiconductor devices, and interface connections can provide electrical connections between through vias of adjacent DRAM semiconductor devices. External connections can receive a power supply potential and a data signal.

PRIORITY CLAIMS

This application is a continuation of U.S. patent application Ser. No.15/836,851, filed Dec. 9, 2017, which is a continuation of U.S. patentapplication Ser. No. 15/626,534 filed Jun. 19, 2017, issued as U.S. Pat.No. 9,842,830, which is a continuation of U.S. patent application Ser.No. 15/469,448 filed Mar. 24, 2017, issued as U.S. Pat. No. 9,685,427,which is a continuation of U.S. patent application Ser. No. 15/357,829filed Nov. 21, 2016, issued as U.S. Pat. No. 9,607,969, which is acontinuation of U.S. patent application Ser. No. 15/245,563 filed Aug.24, 2016, issued as U.S. Pat. No. 9,508,692, which is a continuation ofU.S. patent application Ser. No. 15/161,468 filed May 23, 2016, issuedas U.S. Pat. No. 9,431,088, which is a continuation of U.S. patentapplication Ser. No. 14/755,157 filed Jun. 30, 2015, issued as U.S. Pat.No. 9,378,778, which claims the benefit of U.S. Provisional PatentApplication Ser. No. 62/175,352, filed Jun. 14, 2015, the contents allof which are incorporated by reference herein.

TECHNICAL FIELD

The present invention relates generally to a multi-chip semiconductordevice, and more particularly to conductive connections within amulti-chip semiconductor device.

BACKGROUND OF THE INVENTION

Multi-chip semiconductor packages can include reference voltages andpower supply voltages generated on each semiconductor device. Suchsupplies may be susceptible to independent noise and/or current loadsfor each semiconductor device which can cause reference voltages andpower supply voltages to greatly vary between devices.

In light of the above, it would be desirable to provide a method ofgenerating power supply voltages and/or reference voltages that can beconsistent among each semiconductor device in a multi-chip semiconductordevice to improve reliability.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a package including a plurality ofsemiconductor devices according to an embodiment.

FIG. 2A is a circuit schematic diagram of a through via according to anembodiment.

FIG. 2B is a circuit schematic diagram of a capacitance enhanced throughvia according to an embodiment.

FIG. 3 is a block diagram of a package including a plurality ofsemiconductor devices according to an embodiment.

FIG. 4 is a block diagram of a package including a plurality ofsemiconductor devices according to an embodiment.

FIG. 5 is a block diagram of a package including a plurality ofsemiconductor devices according to an embodiment.

FIG. 6 is a block diagram of a package including a plurality ofsemiconductor devices according to an embodiment.

FIG. 7 is a top plan view of a package including a plurality ofsemiconductor devices according to an embodiment.

FIG. 8 is a cross sectional diagram of a package including a pluralityof semiconductor devices according to an embodiment.

FIGS. 9A to 9I are cross-sectional diagrams of a semiconductor device atvarious process steps of forming through vias and capacitance enhancedthrough vias according to an embodiment.

FIG. 10 is a cross-section diagram of a semiconductor device includingthrough vias and capacitance enhanced through vias according to anembodiment.

FIG. 11 is a circuit schematic diagram of a portion of a memory arraycircuit according to an embodiment.

FIG. 12 is a waveform diagram illustrating the operation of the memoryarray circuits according to an embodiment.

FIG. 13 is a waveform diagram illustrating a signal with a substantiallystable voltage according to an embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

According to the embodiments set forth below, a package may include aplurality of semiconductor devices (chips). Each chip may includethrough vias (through silicon vias—TSV) that can provide an electricalconnection between chips and between chips and external connections,such as solder connections or solder balls. The through vias may includecapacitance enhanced through vias which may have a capacitance value atleast an order of magnitude greater than the non-capacitance enhancedthrough vias. The capacitance enhanced through vias may be used to routecommon reference potentials and/or power supply potentials between aplurality of the semiconductor devices. In this way, each semiconductordevice may commonly provide current drive for the common referencepotentials and/or power supply potentials. Additionally, the capacitanceenhanced through vias may include an increased capacitance value whichcan provide charge storage to provide an instant current to the commonreference potential and or power supply potential. In this way, commonreference potentials and/or power supply potentials may have reducednoise.

Referring now to FIG. 1, a package including a plurality ofsemiconductor devices according to an embodiment is set forth in aschematic diagram and given the general reference character 100.

The package 100 can include semiconductor devices (110 a, 110 b, 110 c,and 110 d) stacked vertically. Each semiconductor device (110 a, 110 b,110 c, and 110 d) can include through vias V1 for providing anelectrical connection between circuitry and an external connection 150on a bottom surface of package 100. Through vias V1 can be formed toprovide an electrical connection from a front side of a respectivesemiconductor device (110 a, 110 b, 110 c, and 110 d) to a back side ofthe respective semiconductor device (110 a, 110 b, 110 c, and 110 d).

Each semiconductor device (110 a, 110 b, 110 c, and 110 d) may alsoinclude capacitance enhanced through vias V2 for providing an electricalconnection to commonly connected reference potentials and/or powersupply potentials between the semiconductor devices (110 a, 110 b, 110c, and 110 d) from a front side to a back side of the respectivesemiconductor device (110 a, 110 b, 110 c, and 110 d). Eachsemiconductor device (110 a, 110 b, 110 c, and 110 d) may includereference voltage generating circuitry and internal power supplygenerating circuitry. Semiconductor device 110 a may include a referencevoltage generator circuit 112 a for generating a reference voltage Vref,a power supply voltage generator circuit 114 a for generating a boostedpower supply voltage Vpp, a reference voltage generator circuit 116 afor generating a bit line reference voltage Vblr, and an internal powersupply voltage generator circuit 118 a for generating an internal powersupply voltage Vint. Semiconductor device 110 b may include a referencevoltage generator circuit 112 b for generating a reference voltage Vref,a power supply voltage generator circuit 114 b for generating a boostedpower supply voltage Vpp, a reference voltage generator circuit 116 bfor generating a bit line reference voltage Vblr, and an internal powersupply voltage generator circuit 118 b for generating an internal powersupply voltage Vint. Semiconductor device 110 c may include a referencevoltage generator circuit 112 c for generating a reference voltage Vref,a power supply voltage generator circuit 114 c for generating a boostedpower supply voltage Vpp, a reference voltage generator circuit 116 cfor generating a bit line reference voltage Vblr, and an internal powersupply voltage generator circuit 118 c for generating an internal powersupply voltage Vint. Semiconductor device 110 d may include a referencevoltage generator circuit 112 d for generating a reference voltage Vref,a power supply voltage generator circuit 114 d for generating a boostedpower supply voltage Vpp, a reference voltage generator circuit 116 dfor generating a bit line reference voltage Vblr, and an internal powersupply voltage generator circuit 118 d for generating an internal powersupply voltage Vint.

Interface connections 122 may be formed in regions (120 a, 120 b, and120 c) between adjacent semiconductor devices (110 a-110 b, 110 b-110 c,and 110 c-110 d) to provide electrical connections between respectivethrough vias V1 and between respective capacitance enhanced through viasV2 of adjacent semiconductor devices (110 a-110 b, 110 b-110 c, and 110c-110 d). Interface connections 122 may also be formed in a region 120 dbetween semiconductor device 110 d and an interposer 140. Interfaceconnections 122 may include solder connections, such as solder ballsand/or copper pillars, or the like.

Capacitance enhanced through vias V2 can each include a capacitor formedinside a through hole in which the via resides.

Reference voltage generator circuit 112 a can generate a referencevoltage Vref which can be electrically connected with wiring layers to acapacitance enhanced through via V2. Reference voltage generator circuit112 b can generate a reference voltage Vref which can be electricallyconnected with wiring layers to a capacitance enhanced through via V2.Reference voltage generator circuit 112 c can generate a referencevoltage Vref which can be electrically connected with wiring layers to acapacitance enhanced through via V2. Reference voltage generator circuit112 d can generate a reference voltage Vref which can be electricallyconnected with wiring layers to a capacitance enhanced through via V2.

Interface connections 122 may electrically connect all capacitanceenhanced through vias V2 carrying the reference voltage Vref betweensemiconductor devices (110 a, 110 b, 110 c, and 110 d). In this way,each reference voltage generator circuit (112 a, 112 b, 112 c, and 112d) may provide drive for a common reference voltage Vref andadditionally, the reference voltage Vref may have an essentiallymatching potential between each semiconductor device (110 a, 110 b, 110c, and 110 d). Also, because capacitance enhanced through vias V2 have asubstantially large capacitance value than a normal through via V1, asource for charge supply to circuitry receiving the reference voltagecircuit Vref may be provided to reduce noise on the reference voltageVref.

Power supply voltage generator circuit 114 a can generate a boostedpower supply voltage Vpp which can be electrically connected with wiringlayers to a capacitance enhanced through via V2. Power supply voltagegenerator circuit 114 b can generate a boosted power supply voltage Vppwhich can be electrically connected with wiring layers to a capacitanceenhanced through via V2. Power supply voltage generator circuit 114 ccan generate a boosted power supply voltage Vpp which can beelectrically connected with wiring layers to a capacitance enhancedthrough via V2. Power supply voltage generator circuit 114 d cangenerate a boosted power supply voltage Vpp which can be electricallyconnected with wiring layers to a capacitance enhanced through via V2.

Interface connections 122 may electrically connect all capacitanceenhanced through vias V2 carrying the boosted power supply voltage Vppbetween semiconductor devices (110 a, 110 b, 110 c, and 110 d). In thisway, each power supply voltage generator circuit (114 a, 114 b, 114 c,and 114 d) may provide drive for a common boosted power supply voltageVpp and additionally, the boosted power supply voltage Vpp may have anessentially matching potential between each semiconductor device (110 a,110 b, 110 c, and 110 d). Also, because capacitance enhanced throughvias V2 have a substantially large capacitance value than a normalthrough via V1, a source for charge supply to circuitry receiving theboosted power supply voltage Vpp may be provided to reduce noise on theboosted power supply voltage Vpp.

Reference voltage generator circuit 116 a can generate a bit linereference voltage Vblr which can be electrically connected with wiringlayers to a capacitance enhanced through via V2. Reference voltagegenerator circuit 116 b can generate a bit line reference voltage Vblrwhich can be electrically connected with wiring layers to a capacitanceenhanced through via V2. Reference voltage generator circuit 116 c cangenerate a bit line reference voltage Vblr which can be electricallyconnected with wiring layers to a capacitance enhanced through via V2.Reference voltage generator circuit 116 d can generate a bit linereference voltage Vblr which can be electrically connected with wiringlayers to a capacitance enhanced through via V2.

Interface connections 122 may electrically connect all capacitanceenhanced through vias V2 carrying the bit line reference voltage Vblrbetween semiconductor devices (110 a, 110 b, 110 c, and 110 d). In thisway, each reference voltage generator circuit (116 a, 116 b, 116 c, and116 d) may provide drive for a common bit line reference voltage Vblrand additionally, the bit line reference voltage Vblr may have anessentially matching potential between each semiconductor device (110 a,110 b, 110 c, and 110 d). Also, because capacitance enhanced throughvias V2 have a substantially large capacitance value than a normalthrough via V1, a source for charge supply to circuitry receiving thebit line reference voltage Vblr may be provided to reduce noise on thebit line reference voltage Vblr.

Internal power supply voltage generator circuit 118 a can generate aninternal power supply voltage Vint which can be electrically connectedwith wiring layers to a capacitance enhanced through via V2. Internalpower supply voltage generator circuit 118 b can generate an internalpower supply voltage Vint which can be electrically connected withwiring layers to a capacitance enhanced through via V2. Internal powersupply voltage generator circuit 118 c can generate an internal powersupply voltage Vint which can be electrically connected with wiringlayers to a capacitance enhanced through via V2. Internal power supplyvoltage generator circuit 118 d can generate an internal power supplyvoltage Vint which can be electrically connected with wiring layers to acapacitance enhanced through via V2.

Interface connections 122 may electrically connect all capacitanceenhanced through vias V2 carrying the internal power supply voltage Vintbetween semiconductor devices (110 a, 110 b, 110 c, and 110 d). In thisway, each internal power supply voltage generator circuit (118 a, 118 b,118 c, and 118 d) may provide drive for a common internal power supplyvoltage Vint and additionally, the internal power supply voltage Vintmay have an essentially matching potential between each semiconductordevice (110 a, 110 b, 110 c, and 110 d). Also, because capacitanceenhanced through vias V2 have a substantially large capacitance valuethan a normal through via V1, a source for charge supply to circuitryreceiving the internal power supply voltage Vint may be provided toreduce noise on the internal power supply voltage Vint.

Signals and voltages that are provided to/from the package 100 andexternal connections 150 may be electrically connected to through viasV1 by way of wiring 142 formed in interposer 140 and interfaceconnections 122 formed in regions (120 a to 120 d). Signals and voltagescan include a power supply voltage VDD, control signals CTL, and datasignals DATA.

Through vias V1 may provide an electrical connection for signals thatmay transition between logic states, such as control signals CTL anddata signals DATA. Capacitance enhanced through vias V2 may provide anelectrical connection from a first side to a second side of therespective semiconductor device for transmission of signals that remainsubstantially stable such as reference voltages (Vref and Vblr), powersupply voltages (Vint and Vpp) or the like. In this way, noise may bereduced and a reservoir of charge for circuits that provide a load forreference voltages and/or power supply voltages may be provided.

Referring now to FIG. 2A, a circuit schematic diagram of a through viaV1 according to an embodiment is set forth. Through via V1 can include awiring layer 210 having first and second terminals (212 and 214). Thewiring layer 210 may also have a parasitic capacitance Cpar. Theparasitic capacitance Cpar may essentially be a capacitance formed fromthe wiring layer 210 to a substrate of a semiconductor device. It may bedesirable for parasitic capacitance Cpar to be as small as possible sothat signals may be transmitted and transition as fast as possible andcurrent consumption may be reduced.

Referring now to FIG. 2B, a circuit schematic diagram of a capacitanceenhanced through via V2 according to an embodiment is set forth.Capacitance enhanced through via V2 can include a wiring layer 220having first and second terminals (222 and 224). The wiring layer 210may also have a capacitance Cev. The capacitance Cev may be acapacitance formed using the wiring layer 220 as a first capacitorterminal and a second conductor layer as a second capacitor terminal.The wiring layer 220 and the conductor layer may be separated by a thindielectric layer. The conductor layer may be connected to a groundpotential VSS. In this way, capacitance Cev of capacitance enhancedthrough via V2 may have a capacitance value that is substantiallygreater than parasitic capacitance Cpar of through via V1. Inparticular, the capacitance value of capacitance Cev of capacitanceenhanced through via V2 may be at least an order of magnitude (i.e. 10×)greater than the capacitance value of parasitic capacitance Cpar ofthrough via V1.

Referring now to FIG. 3, a package including a plurality ofsemiconductor devices according to an embodiment is set forth in a blockschematic diagram and given the general reference character 300. Package300 can include similar constituents as package 100 of FIG. 1, suchconstituents may be referred to by the same reference character. FIG. 3illustrates aspects of internal power supply voltage generator circuits(118 a to 118 d) for package 100 of FIG. 1.

Package 300 can include semiconductor devices (110 a, 110 b, 110 c, and110 d) and an interposer 140. Semiconductor device 110 a may includethrough vias V1, capacitance enhanced through vias V2, an internal powersupply voltage generator circuit 118 a, and internal circuits 310 a.Internal power supply voltage generator 118 a can be electricallyconnected to receive a power supply voltage VDD from through via V1 andmay provide an internal power supply voltage Vint as an output. Internalcircuits 310 a may be electrically connected to receive internal powersupply voltage Vint. Internal power supply voltage Vint may beelectrically connected to capacitance enhanced through via V2.Semiconductor device 110 b may include through vias V1, capacitanceenhanced through vias V2, an internal power supply voltage generatorcircuit 118 b, and internal circuits 310 b. Voltage generator circuit118 b can be electrically connected to receive a power supply voltageVDD from through via V1 and may provide an internal power supply voltageVint as an output. Internal circuits 310 b may be electrically connectedto receive internal power supply voltage Vint. Internal power supplyvoltage Vint may be electrically connected to capacitance enhancedthrough via V2. Semiconductor device 110 c may include through vias V1,capacitance enhanced through vias V2, an internal power supply voltagegenerator 118 c, and internal circuits 310 c. Internal power supplyvoltage generator circuit 118 c can be electrically connected to receivea power supply voltage VDD from through via V1 and may provide aninternal power supply voltage Vint as an output. Internal circuits 310 cmay be electrically connected to receive internal power supply voltageVint. Internal power supply voltage Vint may be electrically connectedto capacitance enhanced through via V2. Semiconductor device 110 d mayinclude through vias V1, capacitance enhanced through vias V2, aninternal power supply voltage generator circuit 118 d, and internalcircuits 310 d. Internal power supply voltage generator circuit 118 dcan be electrically connected to receive a power supply voltage VDD fromthrough via V1 and may provide an internal power supply voltage Vint asan output. Internal circuits 310 d may be electrically connected toreceive internal power supply voltage Vint. Internal power supplyvoltage Vint may be electrically connected to capacitance enhancedthrough via V2.

Package 300 may receive power supply voltage VDD, externally from anexternal connection 150. Only one external connection 150 is illustratedto avoid unduly cluttering up the figure. Power supply voltage VDD maybe electrically connected to respective internal power supply voltagegenerator circuits (118 a, 118 b, 118 c, and 118 d) by way of wiring 142through interposer 140, interface connections 122, and through vias V1.

Internal power supply voltage generator circuits (118 a, 118 b, 118 c,and 118 d) may operate to collectively and in parallel provide acommonly connected internal power supply voltage Vint. Internal powersupply voltage Vint may be commonly connected by way of interfaceconnections 122 and capacitance enhanced through vias V2. By commonlygenerating and commonly connecting internal power supply voltage Vintusing internal power supply voltage generator circuits (118 a, 118 b,118 c, and 118 d), each internal power supply voltage generator circuit(118 a, 118 b, 118 c, and 118 d) may be made smaller (i.e. lower drivestrength) than in conventional semiconductor devices because eachinternal power supply voltage generator circuit (118 a, 118 b, 118 c,and 118 d) may only provide a portion of the current required by anactive internal circuit.

Because internal circuits (310 a, 310 b, 310 c, and 310 d) are commonlyelectrically connected to receive internal power supply voltage Vint,the load may be distributed.

Due to increased capacitance value of capacitance enhanced through viasV2 electrically connected to receive and transmit internal power supplyvoltage Vint, essentially instantaneous charge may be locally availablefor each semiconductor device (110 a, 110 b, 110 c, and 110 d) and noisemay be reduced and/or attenuated.

Referring now to FIG. 4, a package including a plurality ofsemiconductor devices according to an embodiment is set forth in a blockschematic diagram and given the general reference character 400. Package400 can include similar constituents as package 100 of FIG. 1, suchconstituents may be referred to by the same reference character. FIG. 4illustrates aspects of internal power supply voltage generator circuits(118 a to 118 d) and reference voltage generator circuits (112 a to 112d) for package 100 of FIG. 1.

Package 400 can include semiconductor devices (110 a, 110 b, 110 c, and110 d). Each semiconductor device (110 a to 110 d) can respectivelyinclude internal power supply voltage generator circuits (118 a to 118d) arranged as discussed above with respect to package 300 of FIG. 3.Each semiconductor device (110 a to 110 d) can respectively include arespective reference voltage generator circuit (112 a to 112 d) andinput buffer circuit (410 a to 410 d).

In semiconductor device 110 a, internal power supply voltage Vint may beprovided to reference voltage generator 112 a. Reference voltagegenerator circuit 112 a can provide a reference voltage Vref. An inputbuffer circuit 410 a may receive reference voltage Vref at a first inputterminal (a negative input terminal). Input buffer circuit 410 a mayreceive a data signal DATA at a second input terminal (a positive inputterminal). Data signal DATA may be provided externally from an externalconnection 150 and through electrical connection 142, interfaceconnections 122 and through vias V1. Input buffer circuit 410 a mayprovide a data signal Din-a as an output.

In semiconductor device 110 b, internal power supply voltage Vint may beprovided to reference voltage generator 112 b. Reference voltagegenerator circuit 112 b can provide a reference voltage Vref. An inputbuffer circuit 410 b may receive reference voltage Vref at a first inputterminal (a negative input terminal). Input buffer circuit 410 b mayreceive a data signal DATA at a second input terminal (a positive inputterminal). Data signal DATA may be provided externally from an externalconnection 150 and through electrical connection 142, interfaceconnections 122 and through vias V1. Input buffer circuit 410 b mayprovide a data signal Din-b as an output.

In semiconductor device 110 c, internal power supply voltage Vint may beprovided to reference voltage generator circuit 112 c. Reference voltagegenerator circuit 112 c can provide a reference voltage Vref. An inputbuffer circuit 410 c may receive reference voltage Vref at a first inputterminal (a negative input terminal). Input buffer circuit 410 c mayreceive a data signal DATA at a second input terminal (a positive inputterminal). Data signal DATA may be provided externally from an externalconnection 150 and through electrical connection 142, interfaceconnections 122 and through vias V1. Input buffer circuit 410 c mayprovide a data signal Din-c as an output.

In semiconductor device 110 d, internal power supply voltage Vint may beprovided to reference voltage generator 112 d. Reference voltagegenerator circuit 112 d can provide a reference voltage Vref. An inputbuffer circuit 410 d may receive reference voltage Vref at a first inputterminal (a negative input terminal). Input buffer circuit 410 d mayreceive a data signal DATA at a second input terminal (a positive inputterminal). Data signal DATA may be provided externally from an externalconnection 150 and through electrical connection 142, interfaceconnections 122 and through vias V1. Input buffer circuit 410 d mayprovide a data signal Din-d as an output.

Reference voltage generator circuits (112 a, 112 b, 112 c, and 112 d)may operate to collectively and in parallel provide a commonly connectedreference voltage Vref. Reference voltage Vref may be commonly connectedby way of interface connections 122 and capacitance enhanced throughvias V2. By commonly generating and commonly connecting referencevoltage Vref using reference voltage generator circuits (112 a, 112 b,112 c, and 112 d), each reference voltage generator circuit (112 a, 112b, 112 c, and 112 d) may be made smaller (i.e. lower drive strength)than in conventional semiconductor devices because each referencevoltage generator circuit (112 a, 112 b, 112 c, and 112 d) may onlyprovide a portion of the current required by an active internal circuit.

Because input buffer circuits (410 a, 410 b, 410 c, and 410 d) arecommonly electrically connected to receive reference voltage Vref anddata signal DATA, input levels of data signal DATA may be readconsistently among the different semiconductor devices (110 a, 110 b,110 c, and 110 d). In this way, input noise margin levels may beimproved and data reliability may be improved.

Due to increased capacitance value of capacitance enhanced through viasV2 electrically connected to receive and transmit reference voltageVint, essentially instantaneous charge may be locally available for eachsemiconductor device (110 a, 110 b, 110 c, and 110 d) and noise may bereduced and/or attenuated.

Referring now to FIG. 5, a package including a plurality ofsemiconductor devices according to an embodiment is set forth in a blockschematic diagram and given the general reference character 500. Package500 can include similar constituents as package 100 of FIG. 1, suchconstituents may be referred to by the same reference character. FIG. 5illustrates aspects of power supply voltage generator circuits (118 a to118 d) and power supply voltage generator circuits (114 a to 114 d) forpackage 100 of FIG. 1.

Package 500 can include semiconductor devices (110 a, 110 b, 110 c, and110 d). Each semiconductor device (110 a to 110 d) can respectivelyinclude voltage generator circuits (118 a to 118 d) arranged asdiscussed above with respect to package 300 of FIG. 3. Eachsemiconductor device (110 a to 110 d) can respectively include a powersupply voltage generator circuit (114 a to 114 d) and memory arraycircuits (510 a to 510 d).

In semiconductor device 110 a, internal power supply voltage Vint may beprovided to power supply voltage generator circuit 114 a. Power supplyvoltage generator circuit 114 a can provide a boosted power supplyvoltage Vpp. A memory array circuit 510 a may receive boosted powersupply voltage Vpp. Boosted power supply voltage Vpp may be used todrive word lines (not shown) in memory array circuit 510 a.

In semiconductor device 110 b, internal power supply voltage Vint may beprovided to power supply voltage generator circuit 114 b. Power supplyvoltage generator circuit 114 b can provide a boosted power supplyvoltage Vpp. A memory array circuit 510 b may receive boosted powersupply voltage Vpp. Boosted power supply voltage Vpp may be used todrive word lines (not shown) in memory array circuit 510 b.

In semiconductor device 110 c, internal power supply voltage Vint may beprovided to power supply voltage generator circuit 114 c. Power supplyvoltage generator circuit 114 c can provide a boosted power supplyvoltage Vpp. A memory array circuit 510 c may receive boosted powersupply voltage Vpp. Boosted power supply voltage Vpp may be used todrive word lines (not shown) in memory array circuit 510 c.

In semiconductor device 110 d, internal power supply voltage Vint may beprovided to power supply voltage generator circuit 114 d. Power supplyvoltage generator circuit 114 d can provide a boosted power supplyvoltage Vpp. A memory array circuit 510 d may receive boosted powersupply voltage Vpp. Boosted power supply voltage Vpp may be used todrive word lines (not shown) in memory array circuit 510 d.

Power supply voltage generator circuits (114 a, 114 b, 114 c, and 114 d)may operate to collectively and in parallel provide a commonly connectedboosted power supply voltage Vpp. Boosted power supply voltage Vpp maybe commonly connected by way of interface connections 122 andcapacitance enhanced through vias V2. By commonly generating andcommonly connecting boosted power supply voltage Vpp using power supplyvoltage generator circuits (114 a, 114 b, 114 c, and 114 d), each powersupply voltage generator circuit (114 a, 114 b, 114 c, and 114 d) may bemade smaller (i.e. lower drive strength) than in conventionalsemiconductor devices because each boosted power supply voltagegenerator circuit (114 a, 114 b, 114 c, and 114 d) may only provide aportion of the current required by an active internal circuit.

Boosted power supply voltage Vpp may provide a high level of a word linein memory array circuits (510 a to 510 d). Because boosted power supplyvoltage Vpp is commonly connected between semiconductor devices (110 a,110 b, 110 c, and 110 d), a similar potential may be written into memorycells (dynamic random access memory cells) in memory array circuits (510a, 510 b, 510 c, and 510 d). In this way, parameters such aspause-refresh timing may be consistent between devices and reliabilitymay be improved.

Due to increased capacitance value of capacitance enhanced through viasV2 electrically connected to receive and transmit boosted power supplyvoltage Vpp, essentially instantaneous charge may be locally availablefor each semiconductor device (110 a, 110 b, 110 c, and 110 d) and noisemay be reduced and/or attenuated.

Boosted power supply voltage Vpp may have a potential greater thaninternal power supply potential Vint and power supply voltage generatorcircuits (114 a, 114 b, 114 c, and 114 d) may include voltage pumpsincluding boost capacitors.

Referring now to FIG. 6, a package including a plurality ofsemiconductor devices according to an embodiment is set forth in a blockschematic diagram and given the general reference character 600. Package600 can include similar constituents as package 100 of FIG. 1, suchconstituents may be referred to by the same reference character. FIG. 6illustrates aspects of voltage generator circuits (118 a to 118 d) andreference voltage generator circuits (116 a to 116 d) for package 100 ofFIG. 1.

Package 600 can include semiconductor devices (110 a, 110 b, 110 c, and110 d). Each semiconductor device (110 a to 110 d) can respectivelyinclude voltage generator circuits (118 a to 118 d) arranged asdiscussed above with respect to package 300 of FIG. 3. Eachsemiconductor device (110 a to 110 d) can respectively include areference voltage generator circuit (116 a to 116 d) and memory arraycircuits (610 a to 610 d).

In semiconductor device 110 a, internal power supply voltage Vint may beprovided to reference voltage generator circuit 116 a. Reference voltagegenerator circuit 116 a can provide a bit line reference voltage Vblr. Amemory array circuit 610 a may receive bit line reference voltage Vblr.Bit line reference voltage Vblr may be used to precharge bit lines (notshown) in memory array circuit 610 a.

In semiconductor device 110 b, internal power supply voltage Vint may beprovided to reference voltage generator circuit 116 b. Reference voltagegenerator circuit 116 b can provide a bit line reference voltage Vblr. Amemory array circuit 610 b may receive bit line reference voltage Vblr.Bit line reference voltage Vblr may be used to precharge word lines (notshown) in memory array circuit 610 b.

In semiconductor device 110 c, internal power supply voltage Vint may beprovided to reference voltage generator circuit 116 c. Reference voltagegenerator circuit 116 c can provide a bit line reference voltage Vblr. Amemory array circuit 610 c may receive bit line reference voltage Vblr.Bit line reference voltage Vblr may be used to precharge word lines (notshown) in memory array circuit 610 c.

In semiconductor device 110 d, internal power supply voltage Vint may beprovided to reference voltage generator circuit 116 d. Reference voltagegenerator circuit 116 d can provide a bit line reference voltage Vblr. Amemory array circuit 610 d may receive bit line reference voltage Vblr.Bit line reference voltage Vblr may be used to precharge word lines (notshown) in memory array circuit 610 d.

Reference voltage generator circuits (116 a, 116 b, 116 c, and 116 d)may operate to collectively and in parallel provide a commonly connectedbit line reference voltage Vblr. Bit line reference voltage Vblr may becommonly connected by way of interface connections 122 and capacitanceenhanced through vias V2. By commonly generating and commonly connectingbit line reference voltage Vblr using reference voltage generatorcircuits (116 a, 116 b, 116 c, and 116 d), each reference voltagegenerator circuit (116 a, 116 b, 116 c, and 116 d) may be made smaller(i.e. lower drive strength) than in conventional semiconductor devicesbecause each reference voltage generator circuit (116 a, 116 b, 116 c,and 116 d) may only provide a portion of the current required by anactive internal circuit.

Bit line reference voltage Vblr may provide a precharge potential to bitlines in memory array circuits (610 a to 610 d). Because bit linereference voltage Vblr is commonly connected between semiconductordevices (110 a, 110 b, 110 c, and 110 d), a similar potential may beprecharged in bit lines in memory array circuits (610 a, 610 b, 610 c,and 610 d). In this way, parameters such as data integrity andpause-refresh timing may be consistent between devices and reliabilitymay be improved.

Due to increased capacitance value of capacitance enhanced through viasV2 electrically connected to receive and transmit bit line referencevoltage Vblr, essentially instantaneous charge may be locally availablefor each semiconductor device (110 a, 110 b, 110 c, and 110 d) and noisemay be reduced and/or attenuated.

Bit line reference voltage Vblr may have a potential less than internalpower supply potential Vint and have a potential that is essentiallymidway between internal power supply potential Vint and a referencepotential such as a ground potential.

Referring now to FIG. 7, a top plan view of a package including aplurality of semiconductor devices according to an embodiment is setforth and given the general reference character 700.

The top view of package 700 illustrates a top surface of an upper mostsemiconductor device 710 a.

Package 700 includes through vias V1 and capacitance enhanced throughvias V2 arranged in an array.

Each through via V1 can include a conductive material 722 providing anelectrical connection through a semiconductor device.

Each capacitance enhanced through via V2 can include a conductivematerial 712, a conductive material 714, and a dielectric material 716.The conductive material 712 can provide an electrical connection througha semiconductor device. The conductive material 712 can provide a firstcapacitor node and the conductive material 714 can provide a secondcapacitor node. Dielectric material 716 can be formed between conductivematerial 712 and conductive material 714. In this way, each capacitanceenhance through via V2 may include a capacitor having a first terminalformed from conductive material 712 and a second terminal formed byconductive material 714.

Conductive material 714 may be an annular shape surrounding conductivematerial 712 and separated by dielectric material 716. Conductivematerial 712 may have an annular outer surface. Dielectric material 716may have an annular shape.

Package 700 includes a capacitance enhanced through via formed in region720, a through via formed in region 730, and a capacitance enhancethrough via formed in region 740 shown along the line VIII-VIII′.

Referring now to FIG. 8, a cross sectional diagram of a packageincluding a plurality of semiconductor devices according to anembodiment is set forth and given the general reference character 800.Package 800 of FIG. 8 illustrates a cross-section of package 700 alongthe line VIII-VIII′.

Package 800 can include a semiconductor device 810 a, a semiconductordevice 810 b, a semiconductor device 810 c, and a semiconductor device810 d. Semiconductor device 810 a may correspond to semiconductor device710 a in package 700 of FIG. 7. Package 800 may also include aninterposer 140.

Semiconductor device 810 a may include a capacitance enhanced throughvia V2 formed in region 720 and a through via V1 formed in region 730.Each capacitance enhanced through via V2 may include a first conductivematerial 712 and a second conductive material 714, with a dielectriclayer 716 formed there between. The second conductive material 714 maybe electrically connected to a ground potential VSS. In this way, secondconductive material 714 may provide a first terminal for a capacitor andfirst conductive material 712 may provide both a second terminal for acapacitor and a conductive trace for a voltage, such as an internalpower supply voltage Vint, a boosted power supply voltage Vpp, areference voltage Vref, and/or a bit line reference voltage Vblr, or thelike that may be commonly generated by and provided to semiconductordevices (810 a, 810 b, 810 c, and 810 d).

Interface connections 822 may provide electrical connections betweenvertically adjacent through vias V1 and between vertically adjacentcapacitance enhanced through vias V2. In particular, interfaceconnections 822 may provide electrical connections between firstconductive material 712 of vertically adjacent capacitance enhancedthrough vias V2 and interface connections 822 may provide electricalconnections between conductive material 722 of vertically adjacentthrough vias V1.

Through vias V1 in conjunction with interface connections 822, wiring142 and external connections 150 may provide an electrical connection toexternal signals (such as data and control signals) and supplypotentials such as power supply VDD and ground potential VSS.

Each semiconductor device (810 a, 810 b, 810 c, and 810 d) may include arespective internal circuit (820 a, 820 b, 820 c, and 820 d). Eachinternal circuit (820 a, 820 b, 820 c, and 820 d) may be electricallyconnected to a capacitance enhanced through via V2 by way of a wiring850. Internal circuits (820 a, 820 b, 820 c, and 820 d) may correspondwith a respective internal power supply generator circuit (118 a, 118 b,118 c, and 118 d), power supply generator circuit (114 a, 114 b, 114 c,and 114 d), reference generator circuit (112 a, 112 b, 112 c, and 112d), and/or bit line reference generator circuit (116 a, 116 b, 116 c,and 116 d) illustrated in FIG. 1.

Semiconductor devices (810 b and 810 c) may include internal circuits(830 b and 830 c), respectively. Internal circuits (830 b and 830 c) maybe electrically connected to a respective capacitance enhanced throughvia V2 by way of wiring 850. In this way, second conductive material 714may provide a first terminal for a capacitor and first conductivematerial 712 may provide both a second terminal for a capacitor and aconductive trace for a voltage, such as an internal power supply voltageVint, a boosted power supply voltage Vpp, a reference voltage Vref,and/or a bit line reference voltage Vblr, or the like that can becommonly generated by and provided to semiconductor devices (810 b and810 c), exclusively.

Capacitance enhance through via V2 formed in the bottom semiconductordevice 810 d of the stack of semiconductor devices (810 a to 810 d) maynot be electrically connected to a interface connection 822 on a bottomsurface of the semiconductor device 810 d.

FIGS. 9A to 9I are cross-sectional diagrams of a semiconductor device atvarious process steps of forming through vias and capacitance enhancedthrough vias according to an embodiment.

Referring now to FIG. 9A, in a first step, a mask layer 912 may beformed and patterned on a substrate 910 to form openings 914 in masklayer 912.

Referring now to FIG. 9B, in a next step, a deep trench 916 may beetched in the substrate 910 through openings 914 in an anisotropicprocess. The deep trench 916 may have an annular shape from a top view.

Referring now to FIG. 9C, in a next step, mask layer 912 may be removedand an oxide layer (not shown) may be deposited or grown on the surfaceincluding a surface of deep trench 916 followed by the deposition of aconductive material 918 being deposited over the entire surface ofsubstrate 910 to fill deep trench 916. Conductive material 918 mayinclude at least one material selected from the group consisting of:polysilicon, copper, aluminum, cobalt, nickel, and titanium.

Referring now to FIG. 9D, in a next step, a chemical mechanicalpolishing process may be used to remove the conductive material 918 fromthe upper surface of substrate 910, leaving conductive material 918 inthe deep trench. In a next step, a mask layer 920 may be formed andpatterned on the upper surface of substrate 910 to form openings 922 inmask layer 920.

Referring now to FIG. 9E, in a next step, a deep trench 932 may beetched in the substrate 910 through openings 922 in an anisotropicprocess. Deep trench 932 may have an annular shape from a top view.

Referring now to FIG. 9F, in a next step, mask layer 920 may be removedand an oxide layer (not shown) may be deposited or grown on the surfaceincluding a surface of deep trench 932 followed by the deposition of aconductive material 924 being deposited over the entire surface ofsubstrate 910 including the surface of deep trench 932. Next, adielectric material 926 may be deposited over the entire surface ofconductive material with an atomic layer deposition method. Conductivematerial 924 may include at least one material selected from the groupconsisting of: polysilicon, copper, aluminum, cobalt, nickel, andtitanium. Dielectric material 926 may include at least one materialselected from the group consisting of: silicon dioxide, nitride,zirconium oxide, aluminum oxide, and hafnium oxide.

Referring now to FIG. 9G, a conductive material 928 may be depositedover the entire surface of substrate 910 including filling the remainderof deep trench 932. Conductive material 928 may include at least onematerial selected from the group consisting of: polysilicon, copper,aluminum, cobalt, nickel, and titanium.

Referring now to FIG. 9H, in a next step, a chemical mechanicalpolishing process may be used to remove the conductive material 924,dielectric material 926, and conductive material 928 from the uppersurface of substrate 910, leaving conductive material 924, dielectricmaterial 926, and conductive material 928 in the deep trench 932.

Referring now to FIG. 9I, in a next step, a substrate 910 may be thinned(a step of thinning) by grinding the back surface to remove the lowerportions of substrate 910, conductive material 918, conductive material924, dielectric material 926, and conductive material 928. In this way,through vias V1 and capacitance enhanced through vias V2 may be formedby exposing conductive material 928. Through vias V1 may includeconductive material 918 to provide an electrical connection through asemiconductor device including substrate 910. Capacitance enhancethrough vias V2 may include conductive material 924 providing a firstterminal for a capacitor, dielectric material 926 providing a dielectriclayer for a capacitor, and conductive material 928 providing a secondterminal for a capacitor and an electrical connection through asemiconductor device including substrate 910.

Referring now to FIG. 10, a semiconductor device including through viasand capacitance enhance through vias according to an embodiment is setforth in a cross-sectional diagram. The semiconductor device in FIG. 10illustrates subsequent interconnect wiring after through via V1 andcapacitance enhance through via V2 structures have been formed.

In particular, the semiconductor device 1000 may further include a firstcircuit 1010 and a second circuit 1020. First circuit 1010 maycorrespond to any of internal power supply voltage generator circuits(118 a to 118 d), as just one example. Second circuit 1020 maycorrespond to any of reference voltage generator circuits (112 a to 112d), boosted power supply voltage generator circuits (114 a to 114 d),bit line reference voltage generator circuits (116 a to 116 d), orinternal power supply voltage generator circuits (118 a to 118 d), asjust a few examples.

In a step, an insulating layer 1030 may be deposited and patterned. In anext step, a conductive material may be formed in the patterned areas ofinsulating layer 1030 to form interconnects (1012, 1014, and 1016).

In a next step, an insulating layer 1034 may be deposited and patterned.In a next step, a conductive material may be formed in the patternedareas of insulating layer 1034 to form a contact pad 1036 and a contactpad 1038.

In a step, an insulating layer 1038 may be patterned and etched toprovide openings to contact pads (1036 and 1038).

In a step, an insulating layer 1002 may be patterned and etched toprovide openings to contact pads (1004 and 1006), respectively, formedon a bottom surface of through via V1 and capacitance enhanced throughvia V2.

Contact pads (1036 and 1038) may be electrically connected to interfaceconnections 122 (FIG. 1) on an upper surface of semiconductor device1000 as needed and contact pads (1004 and 1006) may be electricallyconnected to interface connections 122 (FIG. 1) on bottom surface ofsemiconductor device 1000 as needed.

All of the steps illustrated in FIGS. 9A-9I and FIG. 10 may be performedsimultaneously on a plurality of semiconductor devices on a contiguouswafer.

Subsequent to the process steps illustrated in FIGS. 9A-9I and FIG. 10,the wafer including semiconductor devices may be diced. Interfaceconnections 122 may be placed on contact pads (1036 and 1038) or surfaceof semiconductor device 1000 as needed and contact pads (1004 and 1006).Interface connections 122 may be solder balls, solder bumps, or copperpillars, or the like. A plurality of semiconductors devices may then bestacked on an interposer 140, encapsulated, and external connections 150may be placed to form a package of including a plurality ofsemiconductor devices (100, 300, 400, 500, 600, 700, and/or 800).

Referring now to FIG. 11, a portion of memory array circuit according toan embodiment is set forth in a circuit schematic diagram.

The portion of a memory array circuit of FIG. 11 may include elements ofmemory array circuits (510 a, 510 b, 510 c, and 510 d) in FIG. 5 and/orelements of memory array circuits (610 a, 610 b, 610 c, and 610 d) inFIG. 6.

The portion of a memory array circuit of FIG. 11 may include a word linedriver circuit 1110, a bit line precharge circuit 1120, and a memorycell 1130. Memory cell 1130 may be a dynamic random access memory (DRAM)cell including a transistor (an insulated gate field effect transistor(IGFET)) and a capacitor.

Word line driver circuit 1110 may receive boosted power supply voltageVpp and may have an output connected to a word line WL. Bit lineprecharge circuit 1120 may receive a bit line reference voltage Vblr andmay have an output connected to a bit line BL. Memory cell 1130 may beconnected to word line WL and bit line BL at a cross point.

Referring now to FIG. 12, a waveform diagram illustrating the operationof the memory array circuits of FIG. 11 according to an embodiment isset forth.

The waveform diagram of FIG. 12 includes waveforms for word line WL andbit line BL.

Initially, bit line BL may be precharged to the potential of the bitline reference voltage Vblr by bit line precharge circuit 1120. After amemory access, word line driver circuit 1110 may drive word line WL froma logic low to a logic high at time T1. At this time, word line WL maydriven to a boosted power supply voltage Vpp. A transistor in memorycell MC may be turned on to transfer charge from a capacitor in memorycell MC to bit line BL. At time T2, a sense amplifier (not shown) maydrive the bit line to a logic high (solid line) or logic low (dashedline) in response to the charge that was transferred from the memorycell MC to bit line BL.

At a time T3, word line driver circuit 1110 may drive word line WL backto a logic low level. At a time T4, bit line precharge circuit 1120 mayprecharge bit line BL back to a bit line reference voltage Vblr.

Referring now to FIG. 13, a waveform diagram illustrating a signal witha substantially stable voltage is set forth.

The waveform diagram of FIG. 13 includes a signal 1310 that is intendedto be a substantially stable voltage. Signal 1310 may be internal powersupply voltage Vint, boosted power supply voltage Vpp, bit linereference voltage Vblr, reference voltage Vref, or the like. At time T1,a load attached to signal 1310 can draw an instantaneous current causingnoise in the way of a dip. Dip 1312 can represent a case in whichsemiconductor devices (110 a, 110 b, 110 c, and 110 d) includecapacitance enhance vias V2 and provide the voltage generators (112a-112 d, 114 a-114 d, 116 a-116 d, and 118 a-118 d), respectively. Dip1314 may represent a case in which a semiconductor device may generatethe signal 1310 without the parallel driving of voltage generatorscommonly to a plurality of semiconductor devices or the use ofcapacitance enhanced vias V2. In particular, if a reference voltage Vrefis used as a reference potential in an input buffer, incoming signals,such as data signal DATA or control signals CTL may be erroneously readwhen noise causes substantial variations in voltage level. Likewise, ifsubstantial variations in voltage level occur in a bit line referencevoltage Vblr, data in a dynamic random access memory (DRAM) cell may beerroneously read. If substantial variations in a voltage level occur ina boosted power supply voltage Vpp, proper levels may not be writteninto a DRAM cell and pause times may be compromised. If substantialvariations in a voltage level occur in an internal power supply voltageVint, internal circuits may not operate properly. Furthermore, internalpower supply voltage Vint may be used to generate other voltages, suchas boosted power supply voltage Vpp, bit line reference voltage Vblr,and reference voltage Vref, which can compound erroneous operations of asemiconductor device.

According to the embodiments, through vias V1 may provide an electricalconnection for signals that may transition between logic states, such ascontrol signals CTL and data signals DATA. Capacitance enhanced throughvias V2 may provide an electrical connection from a first side to asecond side of the respective semiconductor device for transmission ofsignals that remain substantially stable such as reference voltages(Vref and Vblr), power supply voltages (Vint and Vpp) or the like. Suchreference voltages may remain substantially stable when a respectivesemiconductor device is in a normal (first) mode of operation, such asan active mode, for example, a read or write mode of operation in asemiconductor memory device. In this way, noise may be reduced and areservoir of charge for circuits that provide a load for referencevoltages and/or power supply voltages may be provided.

By distributing power supply generator circuits (114 a to 114 d and 118a to 118 d) and reference voltage generator circuits (112 a to 112 d and116 a to 116 d) throughout a package of a plurality of semiconductordevices (110 a to 110 d), adverse temperature effects may be reduced bydistributing hot spots.

A voltage may be expressed as a potential. Internal power supply voltageVint may be considered an internal power supply potential. Boosted powersupply voltage Vpp may be considered a boosted power supply potential.Bit line reference voltage Vblr may be considered a bit line referencepotential. Reference voltage Vref may be considered a referencepotential.

Other electrical apparatus other than semiconductor devices may benefitfrom the invention.

While various particular embodiments set forth herein have beendescribed in detail, the present invention could be subject to variouschanges, substitutions, and alterations without departing from thespirit and scope of the invention. Accordingly, the present invention isintended to be limited only as defined by the appended claims.

What is claimed is:
 1. A package, comprising: a first dynamic randomaccess memory (DRAM) semiconductor device, a second DRAM semiconductordevice, and a third DRAM semiconductor device stacked in a firstdirection above a first surface of an interposer; a first wiring formedin the interposer providing an electrical connection essentiallyorthogonal to and between the first surface and a second surface,opposite the first surface, of the interposer; a first externalconnection formed on the second surface of the interposer, the firstwiring electrically connected at a central portion of the first externalconnection, the first external connection configured to receive a firstpower supply potential; the first DRAM semiconductor device includes afirst through via, the first through via providing an electricalconnection between a first surface and a second surface of the firstDRAM semiconductor device; the second DRAM semiconductor device includesa second through via, the second through via providing an electricalconnection between a first surface and a second surface of the secondDRAM semiconductor device; the third DRAM semiconductor device includesa third through via, the third through via providing an electricalconnection between a first surface and a second surface of the thirdDRAM semiconductor device; a first interface connection formed betweenthe first DRAM semiconductor device and the second DRAM semiconductordevice providing an electrical connection between the first and secondthrough vias; a second interface connection formed between the secondDRAM semiconductor device and the third DRAM semiconductor deviceproviding an electrical connection between the second and third throughvias; a third interface connection formed between the interposer and thefirst DRAM semiconductor device providing an electrical connectionbetween the first wiring and the first through via, the first wiringproviding an electrical connection between the third interfaceconnection and the first external connection; a second wiring formed inthe interposer providing an electrical connection essentially orthogonalto and between the first surface and the second surface, opposite thefirst surface, of the interposer; and a second external connectionformed on the second surface of the interposer, the second wiringelectrically connected at a central portion of the second externalconnection, the second external connection configured to receive a firstdata signal.
 2. The package of claim 1, wherein: the first wiringextends essentially straight from the first surface to the secondsurface of the interposer.
 3. The package of claim 2, wherein: thesecond wiring extends essentially straight from the first surface to thesecond surface of the interposer and essentially parallel with the firstwiring.
 4. The package of claim 1, wherein: the first wiring extends inone direction from the first surface to the second surface of theinterposer.
 5. The package of claim 4, wherein: the second wiringextends in the one direction from the first surface to the secondsurface of the interposer.
 6. The package of claim 1, wherein: the thirdinterface connection includes copper and solder.
 7. The package of claim1, further including: a first circuit on at least one of the first DRAMsemiconductor device, second DRAM semiconductor device, or third DRAMsemiconductor device, the first circuit coupled to receive the firstpower supply potential and provide a reference potential wherein asecond circuit on at least one of the first DRAM semiconductor device,second semiconductor device or third semiconductor device not includingthe first circuit coupled to receive the reference potential by way ofat least a fourth through via.
 8. The package of claim 7, wherein: thefirst circuit is an internal power supply voltage generator and thereference potential is an internal power supply voltage.
 9. The packageof claim 7, wherein: the second circuit is an input buffer circuitcoupled to receive the reference potential at a first input bufferterminal and the first data signal at a second input buffer terminal.10. The package of claim 7, wherein: the first circuit is a bit linereference generator circuit and the second circuit is a memory arraycircuit.
 11. The package of claim 7, wherein: the first circuit is aboosted power supply voltage generating circuit and the second circuitis a word line driver circuit.
 12. The package of claim 7, wherein: thereference potential remains substantially stable while any of the firstDRAM semiconductor device, second DRAM semiconductor device, or thirdDRAM semiconductor device is in an active mode of operation.
 13. Thepackage of claim 1, further including: the first DRAM semiconductordevice includes a fourth through via, the fourth through via providingan electrical connection between the first surface and the secondsurface of the first DRAM semiconductor device; the second DRAMsemiconductor device includes a fifth through via, the fifth through viaproviding an electrical connection between the first surface and thesecond surface of the second DRAM semiconductor device; the third DRAMsemiconductor device includes a sixth through via, the sixth through viaproviding an electrical connection between the first surface and thesecond surface of the third DRAM semiconductor device; and the secondwiring is coupled to the second external connection at the first surfaceof the interposer, the fourth, fifth and sixth through vias areelectrically coupled in series and the fourth through via is coupled tothe second wiring to receive the first data signal.
 14. The package ofclaim 13, further including: a first circuit on at least one of thefirst DRAM semiconductor device, second DRAM semiconductor device, orthird DRAM semiconductor device, the first circuit coupled to receivethe power supply voltage and provide a reference potential wherein asecond circuit on at least one of the first DRAM semiconductor device,second DRAM semiconductor device or third DRAM semiconductor device notincluding the first circuit coupled to receive the reference potentialby way of at least a seventh through via wherein, a first electricalnode including the seventh through via has a greater capacitance valuethan a second electrical node commonly including the fourth, fifth, andsixth through vias.
 15. The package of claim 14, wherein: the firstelectrical node has a substantially greater capacitance value than thesecond electrical node.
 16. The package of claim 14, wherein: thecapacitance value of the first electrical node is at least twice thecapacitance value of the second electrical node.
 17. The package ofclaim 13, wherein: the package is encapsulated and the first, second,and third through vias comprise copper.
 18. The package of claim 17,wherein: the third interface connection includes copper and solder. 19.The package of claim 17, further including: a fourth interfaceconnection formed between the first DRAM semiconductor device and thesecond DRAM semiconductor device providing an electrical connectionbetween the fourth and fifth through vias; a fifth interface connectionformed between the second DRAM semiconductor device and the third DRAMsemiconductor device providing an electrical connection between thefifth and sixth through vias; and a sixth interface connection formedbetween the interposer and the first DRAM semiconductor device providingan electrical connection between the second wiring and the fourththrough via, the second wiring providing an electrical connectionbetween the sixth interface connection and the second externalconnection.
 20. The package of claim 1, wherein: the first, second, andthird through vias comprise at least one element selected from the groupconsisting of: aluminum, cobalt, nickel, and titanium.